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Integrated Circuit Logic Families MCQs

Electronics Engineering Objective Questions



43. The 74F-Fast TTL integrated-circuit fabrication technique uses reduced interdevice ________ to achieve reduced propagation delays.
Discussion

44.  In a DIP the spacing between pins is typically ________.
Discussion

45.  ________ is about twice as fast as P-MOS.
Discussion

47. The output stage of a TTL gate is a special design called ________.
Discussion

48. The ________ is defined as the maximum number of standard logic inputs that an output can drive reliably.
Discussion

49. ________ is ideally suited for applications using battery power or battery backup power.
Discussion

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